產品資訊

Electrical Properties : Typical Values Test Procedures / Method
Surface Resistivity(表面阻抗):
Outer Surface(外層表面) <1012  ohms/sq EOS/ESD-S11.11-2001
Metallic Layer(金屬層) 100 ohms/sq EOS/ESD-S11.11-2001
Inner Surface(裡層) <1012 ohms/sq EOS/ESD-S11.11-2001
Charge Decay(靜電消散) Less than 0.05 second FTMS-101C Method 4046.1

 

Physical Properties : Typical Values Test Procedures / Method
Bag Thickness(金屬遮蔽袋厚度):    
Polyester Layer(聚脂膜) 12 Mic ASTM D-2103
Metalized Layer(金屬層) 100 Angstroms ASTM D-2103
Polyethylene Layer(聚乙稀膜) 70 Mic ASTM D-2103
Total Thickness(總厚度) 85 Mic ASTM D-2103
Tensile Strength-TD(拉力強度-縱向) 376 kgf/cm2 ASTM D882
Tensile Strength-MD(拉力強度-橫向) 412 kgf/cm2 ASTM D882
Puncture Strength(穿刺強度) 6.18 kgf FTMS 101C Method 2065.1
Tear Strength-TD(撕裂強度-縱向) 1.16 kgf ASTM D1004
Tear Strength-MD(撕裂強度-橫向) 1.22 kgf ASTM D1004
Water Vapor transmission(透濕度) 6.2030 g/m2.day ASTM E96
Elongation-TD(延伸率-縱向) 88.90 % ASTM D882
Elongation-MD(延伸率-橫向) 83.10 % ASTM D1004
Heat Sealing Conditions(熱封條件)    
Temperature(溫度) 108 ℃~220℃  
Time(時間) 0.5~3.5 seconds  
Pressure(壓力) 30~70 PSI  

 

以下為目前規格之半成品(semi-finished product):
W(寬)cm × L(長)cm × T(厚)mm
2-90 5 0.085
2-90 6.25 0.085
2-90 7.5 0.085
2-90 10 0.085
2-90 12.5 0.085
2-90 15 0.085
2-90 16.5 0.085
2-90 17.5 0.085
2-90 20 0.085
2-90 22.5 0.085
2-90 25 0.085
2-90 30 0.085
2-90 35 0.085
2-90 40 0.085
2-90 45 0.085
2-90 50 0.085
2-90 60 0.085

半成品尺寸依實際庫存變動,如需最新半成品、成品庫存明細、測試資料,請洽業務承辦人員。