Electrical Properties : | Typical Values | Test Procedures / Method |
Surface Resistivity(表面阻抗): | ||
Outer Surface(外層表面) | <1012 ohms/sq | EOS/ESD-S11.11-2001 |
Metallic Layer(金屬層) | 100 ohms/sq | EOS/ESD-S11.11-2001 |
Inner Surface(裡層) | <1012 ohms/sq | EOS/ESD-S11.11-2001 |
Charge Decay(靜電消散) | Less than 0.05 second | FTMS-101C Method 4046.1 |
Physical Properties : | Typical Values | Test Procedures / Method |
Bag Thickness(金屬遮蔽袋厚度): | ||
Polyester Layer(聚脂膜) | 12 Mic | ASTM D-2103 |
Metalized Layer(金屬層) | 100 Angstroms | ASTM D-2103 |
Polyethylene Layer(聚乙稀膜) | 70 Mic | ASTM D-2103 |
Total Thickness(總厚度) | 85 Mic | ASTM D-2103 |
Tensile Strength-TD(拉力強度-縱向) | 376 kgf/cm2 | ASTM D882 |
Tensile Strength-MD(拉力強度-橫向) | 412 kgf/cm2 | ASTM D882 |
Puncture Strength(穿刺強度) | 6.18 kgf | FTMS 101C Method 2065.1 |
Tear Strength-TD(撕裂強度-縱向) | 1.16 kgf | ASTM D1004 |
Tear Strength-MD(撕裂強度-橫向) | 1.22 kgf | ASTM D1004 |
Water Vapor transmission(透濕度) | 6.2030 g/m2.day | ASTM E96 |
Elongation-TD(延伸率-縱向) | 88.90 % | ASTM D882 |
Elongation-MD(延伸率-橫向) | 83.10 % | ASTM D1004 |
Heat Sealing Conditions(熱封條件) | ||
Temperature(溫度) | 108 ℃~220℃ | |
Time(時間) | 0.5~3.5 seconds | |
Pressure(壓力) | 30~70 PSI |
以下為目前規格之半成品(semi-finished product): | ||
W(寬)cm × | L(長)cm × | T(厚)mm |
2-90 | 5 | 0.085 |
2-90 | 6.25 | 0.085 |
2-90 | 7.5 | 0.085 |
2-90 | 10 | 0.085 |
2-90 | 12.5 | 0.085 |
2-90 | 15 | 0.085 |
2-90 | 16.5 | 0.085 |
2-90 | 17.5 | 0.085 |
2-90 | 20 | 0.085 |
2-90 | 22.5 | 0.085 |
2-90 | 25 | 0.085 |
2-90 | 30 | 0.085 |
2-90 | 35 | 0.085 |
2-90 | 40 | 0.085 |
2-90 | 45 | 0.085 |
2-90 | 50 | 0.085 |
2-90 | 60 | 0.085 |
半成品尺寸依實際庫存變動,如需最新半成品、成品庫存明細、測試資料,請洽業務承辦人員。