產品資訊

TYVEK® is made from high-density polyethylene fibers (one tenth the width of a human hair), formed by a continuous process of very fine 0.5-10 micrometer fibers. These nondirectional fibers (plexifilaments) are first spun and then bonded together by heat and pressure, without the use of binders and fillers.
Tyvek® is strong, lightweight, soft and smooth, does not fray fibers and particles, antistatic, opaque, water resistant, chemical resistant, scratch resistant and chemically stable.
The unique combination of these properties makes Tyvek® ideal for a broad range of applications in the electronics industry including semiconductor wafer separator, LCD, LED, and hi-tech dust-free product packaging.

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Property TYVEK®
1025D
TYVEK®
1057D
TYVEK®
1073D
Test Method
Basis weight(g/m²) 42.5 55.0 75.0  DIN EN ISO 536(2)
Thickness(μ m) 140 165 210  DIN EN 20534(4)
Tensile(N/2.54cm)-MD 94 140 205 DIN EN ISO 1924-2(5)
Tensile(N/2.54cm)-XD 90 145 215 DIN EN ISO 1924-2(5)
Elongation at Break(%)-MD 11-21  14-30 14-21 DIN EN ISO 1924-2(5)
Elongation at Break(%)-XD 15-25   15-30 17-24 DIN EN ISO 1924-2(5)
Tear Elmendorf(N)-MD  6.0  4.8 5.5 DIN EN 21924
Tear Elmendorf(N)-XD  5.7  5.0 5.7 DIN EN 21924
Opacity(%)  96.0  96.0 97.0  ISO2471(7)
Deiamination-MD(N/2.54cm) 1.0   1.6 1.75  ASTM D2724-87(8)
Burt strength(kPa) 550   830 1200  ISO 2758 
Surface Resistivity(Ω/Sq) ﹤1012   ﹤1012 ﹤1012  ASTM D257 
Static Decay(S) ﹤0.02   ﹤0.02 ﹤0.02  FTMS 101C M4046.1

• For long storage, maintain environment conditions at 25 ± 10℃ and 60 ± 15% RH.

The data above are averages. If the the latest test datas are needed, please contact our sales.