TYVEK® is made from high-density polyethylene fibers (one tenth the width of a human hair), formed by a continuous process of very fine 0.5-10 micrometer fibers. These nondirectional fibers (plexifilaments) are first spun and then bonded together by heat and pressure, without the use of binders and fillers.
Tyvek® is strong, lightweight, soft and smooth, does not fray fibers and particles, antistatic, opaque, water resistant, chemical resistant, scratch resistant and chemically stable.
The unique combination of these properties makes Tyvek® ideal for a broad range of applications in the electronics industry including semiconductor wafer separator, LCD, LED, and hi-tech dust-free product packaging.
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Property | TYVEK® 1025D |
TYVEK® 1057D |
TYVEK® 1073D |
Test Method |
---|---|---|---|---|
Basis weight(g/m²) | 42.5 | 55.0 | 75.0 | DIN EN ISO 536(2) |
Thickness(μ m) | 140 | 165 | 210 | DIN EN 20534(4) |
Tensile(N/2.54cm)-MD | 94 | 140 | 205 | DIN EN ISO 1924-2(5) |
Tensile(N/2.54cm)-XD | 90 | 145 | 215 | DIN EN ISO 1924-2(5) |
Elongation at Break(%)-MD | 11-21 | 14-30 | 14-21 | DIN EN ISO 1924-2(5) |
Elongation at Break(%)-XD | 15-25 | 15-30 | 17-24 | DIN EN ISO 1924-2(5) |
Tear Elmendorf(N)-MD | 6.0 | 4.8 | 5.5 | DIN EN 21924 |
Tear Elmendorf(N)-XD | 5.7 | 5.0 | 5.7 | DIN EN 21924 |
Opacity(%) | 96.0 | 96.0 | 97.0 | ISO2471(7) |
Deiamination-MD(N/2.54cm) | 1.0 | 1.6 | 1.75 | ASTM D2724-87(8) |
Burt strength(kPa) | 550 | 830 | 1200 | ISO 2758 |
Surface Resistivity(Ω/Sq) | ﹤1012 | ﹤1012 | ﹤1012 | ASTM D257 |
Static Decay(S) | ﹤0.02 | ﹤0.02 | ﹤0.02 | FTMS 101C M4046.1 |
• For long storage, maintain environment conditions at 25 ± 10℃ and 60 ± 15% RH.
The data above are averages. If the the latest test datas are needed, please contact our sales.