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TYVEK-50D – Low Ions
Product introduction：
Tyvek® is a registered trademark of DuPont’s exclusive protective material brand in the United States.
TYVEK-50D is specifically designed for semiconductor processes, which is designed and developed for the characteristics required for wafer spacers.
Having low ion pollution, with small particles, it also has a stable and permanent anti-static effect in low humidity environment (12% RH).
It has been verified by rigorous reliability test in the industry that it can effectively reduce the process and wafer storage ion pollution.
Ion pollution reduction
The above wafer pollution pictures show the compliance of wafer thinning and wafer back processing, and other processes. The round box packaging mode is adopted in order to reduce wafer damage and transportation costs. This method has high requirements on the quality of direct contact chip protection materials (separator, interleaf). With *stable low ion control *low dust amount *permanent electrostatic protection, the newly developed TYVEK-50D has met the relevant requirements of the industry.
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| Property | Tyvek® 50D | Test Method |
| Basis weight(g/m²) | 56.0 | DIN EN ISO 536 |
| Thickness(μm) | 165 | DIN EN ISO 534 |
| Deiamination(N/2.54cm) | 1.6 | ASTM D2724 |
| Tensile Strength(N/2.54cm)-MD | 135 | DIN EN ISO 1924-2 |
| Tensile Strength(N/2.54cm)-CD | 140 | DIN EN ISO 1924-2 |
| Elongation (%)-MD | 11.5-17.5 | DIN EN ISO 1924-2 |
| Elongation (%)-CD | 15-22 | DIN EN ISO 1924-2 |
| Elmendorf Tear(N/2.54cm)-MD | 5.3 | DIN EN 21974 |
| Elmendorf Tear(N/2.54cm)-CD | 5.3 | DIN EN 21974 |
| Opacity(%) | >94.1 | ISO 2471 |
| Mullenburst(kPa) | 795 | ISO 2758 |
| Surface Resistivity(Ω/Sq) | ≦1010 | ASTM D257 |
1. Tyvek® sealed: Storage temperature 25-15℃, storage humidity 60 ± 20% RH
2. Tyvek® unsealed: Storage temperature below 26℃, storage humidity below 10% RHThe
above data are the mean. Please contact the business contractor for the latest test data.
