產品資訊

Ion pollution reduction
The above wafer pollution pictures show the compliance of wafer thinning and wafer back processing, and other processes. The round box packaging mode is adopted in order to reduce wafer damage and transportation costs. This method has high requirements on the quality of direct contact chip protection materials (separator, interleaf). With *stable low ion control *low dust amount *permanent electrostatic protection, the newly developed TYVEK-50D has met the relevant requirements of the industry.

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Property Tyvek® 50D Test Method
Basis weight(g/m²) 56.0 DIN EN ISO 536
Thickness(μm) 165 DIN EN ISO 534
Deiamination(N/2.54cm) 1.6 ASTM D2724
Tensile Strength(N/2.54cm)-MD 135 DIN EN ISO 1924-2
Tensile Strength(N/2.54cm)-CD  140 DIN EN ISO 1924-2
Elongation (%)-MD 11.5-17.5 DIN EN ISO 1924-2
Elongation (%)-CD 15-22 DIN EN ISO 1924-2
Elmendorf Tear(N/2.54cm)-MD 5.3 DIN EN 21974
Elmendorf Tear(N/2.54cm)-CD 5.3 DIN EN 21974
Opacity(%) >94.1 ISO 2471
Mullenburst(kPa) 795 ISO 2758
Surface Resistivity(Ω/Sq)     ≦1010  ASTM D257

1. Tyvek® sealed: Storage temperature 25-15℃, storage humidity 60 ± 20% RH
2. Tyvek® unsealed: Storage temperature below 26℃, storage humidity below 10% RHThe
above data are the mean. Please contact the business contractor for the latest test data.